Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Bits per Word
8bit
Number of Words
128M
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C
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0.700 OMR
Each (In a Tray of 480) (ex VAT)
0.735 OMR
Each (In a Tray of 480) (inc VAT)
480
0.700 OMR
Each (In a Tray of 480) (ex VAT)
0.735 OMR
Each (In a Tray of 480) (inc VAT)
480
Technical Document
Specifications
Brand
WinbondMemory Size
1Gbit
Interface Type
Quad-SPI
Package Type
TFBGA
Pin Count
24
Organisation
128M x 8 bit
Mounting Type
Surface Mount
Cell Type
SLC NAND
Minimum Operating Supply Voltage
2.7 V
Maximum Operating Supply Voltage
3.6 V
Dimensions
8.05 x 6.05 x 0.85mm
Number of Bits per Word
8bit
Number of Words
128M
Minimum Operating Temperature
-40 °C
Maximum Operating Temperature
+85 °C