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Yamaichi 0.8mm Pitch 64 Way SMT QFP Prototyping Socket

RS Stock No.: 500-7949Brand: YamaichiManufacturers Part No.: IC149-064-008-B5
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Technical Document

Specifications

Package Type

QFP

Gender

Female

Number Of Contacts

64

Pitch

0.8mm

Body Orientation

Straight

Contact Material

Copper Alloy

Contact Plating

Gold

Socket Mounting Type

Surface Mount

Termination Method

Solder

Housing Material

Nylon, PPS

Country of Origin

Japan

Product details

Prototyping QFP Sockets

This QFP socket has been designed for late prototyping or early production applications, allowing up to 20 insertion cycles of the device without risk of contact degradation or lead damage. The footprint of the socket mirrors that of the device, enabling the socket to be dispensed with favour of direct soldering, without any further changes to the PCB design. Insulator is high temperature thermoplastic. Contacts are copper alloy with tin over nickel plating

Contact resistance 30mΩ (at 10mA)
Current rated 500mA per contact
Flammability UL 94 V-0
Operating temperature -25C to +85C
Temperature for reflow soldering 220C for 60 seconds
Insulation resistance 500mΩ (at 150Vdc)
Surface Mount

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P.O.A.

Yamaichi 0.8mm Pitch 64 Way SMT QFP Prototyping Socket

P.O.A.

Yamaichi 0.8mm Pitch 64 Way SMT QFP Prototyping Socket
Stock information temporarily unavailable.

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
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You may be interested in

Technical Document

Specifications

Package Type

QFP

Gender

Female

Number Of Contacts

64

Pitch

0.8mm

Body Orientation

Straight

Contact Material

Copper Alloy

Contact Plating

Gold

Socket Mounting Type

Surface Mount

Termination Method

Solder

Housing Material

Nylon, PPS

Country of Origin

Japan

Product details

Prototyping QFP Sockets

This QFP socket has been designed for late prototyping or early production applications, allowing up to 20 insertion cycles of the device without risk of contact degradation or lead damage. The footprint of the socket mirrors that of the device, enabling the socket to be dispensed with favour of direct soldering, without any further changes to the PCB design. Insulator is high temperature thermoplastic. Contacts are copper alloy with tin over nickel plating

Contact resistance 30mΩ (at 10mA)
Current rated 500mA per contact
Flammability UL 94 V-0
Operating temperature -25C to +85C
Temperature for reflow soldering 220C for 60 seconds
Insulation resistance 500mΩ (at 150Vdc)
Surface Mount

Ideate. Create. Collaborate

JOIN FOR FREE

No hidden fees!

design-spark
design-spark
  • Download and use our DesignSpark software for your PCB and 3D Mechanical designs
  • View and contribute website content and forums
  • Download 3D Models, Schematics and Footprints from more than a million products
Click here to find out more
You may be interested in