Technical Document
Specifications
Brand
TE ConnectivitySeries
AMPMODU Mod II
Pitch
2.54mm
Number Of Contacts
50
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Board to Board, Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Phosphor Bronze
Current Rating
3.0A
Tail Pin Length
3.2mm
Mating Pin Length
6.7mm
Product details
Unshrouded Pin Headers
Header pins 0.64mm square
Mate with corresponding receptacle housing and PCB receptacles
May be snapped to desired length if required
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.
3.306 OMR
3.306 OMR Each (ex VAT)
3.471 OMR
3.471 OMR Each (inc. VAT)
Standard
1
3.306 OMR
3.306 OMR Each (ex VAT)
3.471 OMR
3.471 OMR Each (inc. VAT)
Stock information temporarily unavailable.
Standard
1
Stock information temporarily unavailable.
Quantity | Unit price |
---|---|
1 - 19 | 3.306 OMR |
20 - 74 | 3.080 OMR |
75 - 299 | 2.910 OMR |
300 - 599 | 2.464 OMR |
600+ | 2.404 OMR |
Technical Document
Specifications
Brand
TE ConnectivitySeries
AMPMODU Mod II
Pitch
2.54mm
Number Of Contacts
50
Number Of Rows
1
Body Orientation
Straight
Shrouded/Unshrouded
Unshrouded
Connector System
Board to Board, Wire to Board
Mounting Type
Through Hole
Termination Method
Solder
Contact Plating
Tin
Contact Material
Phosphor Bronze
Current Rating
3.0A
Tail Pin Length
3.2mm
Mating Pin Length
6.7mm
Product details
Unshrouded Pin Headers
Header pins 0.64mm square
Mate with corresponding receptacle housing and PCB receptacles
May be snapped to desired length if required
2.54mm TE Connectivity AMPMODU™ Range – Style 2 (European)
A wide range of modular interconnects on the industry standard 2.54mm (0.1in ) Grid, addressing applications across all industry sectors. Designed for wire to board or board to board connection, including stacking.