Fischer Elektronik Heatsink, Universal Square Alu, 15.7K/W, 35 x 35 x 10mm, Adhesive Foil, Conductive Foil
Technical Document
Specifications
Brand
Fischer ElektronikFor Use With
Universal Square Alu
Length
35mm
Width
35mm
Height
10mm
Dimensions
35 x 35 x 10mm
Thermal Resistance
15.7K/W
Mounting
Adhesive Foil, Conductive Foil
Colour
Black
Package Type
BGA
Material
Aluminium
Country of Origin
Germany
Product details
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
1.672 OMR
1.672 OMR Each (ex VAT)
1.756 OMR
1.756 OMR Each (inc. VAT)
1
1.672 OMR
1.672 OMR Each (ex VAT)
1.756 OMR
1.756 OMR Each (inc. VAT)
1
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Please check again later.
| quantity | Unit price |
|---|---|
| 1 - 9 | 1.672 OMR |
| 10 - 24 | 1.568 OMR |
| 25 - 49 | 1.534 OMR |
| 50 - 99 | 1.502 OMR |
| 100+ | 1.402 OMR |
Technical Document
Specifications
Brand
Fischer ElektronikFor Use With
Universal Square Alu
Length
35mm
Width
35mm
Height
10mm
Dimensions
35 x 35 x 10mm
Thermal Resistance
15.7K/W
Mounting
Adhesive Foil, Conductive Foil
Colour
Black
Package Type
BGA
Material
Aluminium
Country of Origin
Germany
Product details
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks