Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
6.3V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Maximum Operating Temperature
+105°C
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
6.3 μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Stock information temporarily unavailable.
Please check again later.
0.035 OMR
Each (On a Reel of 2000) (ex VAT)
0.037 OMR
Each (On a Reel of 2000) (inc VAT)
2000
0.035 OMR
Each (On a Reel of 2000) (ex VAT)
0.037 OMR
Each (On a Reel of 2000) (inc VAT)
2000
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
6.3V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Maximum Operating Temperature
+105°C
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
6.3 μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets