Technical Document
Specifications
Brand
WinslowNumber Of Contacts
6
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
7.54mm
Width
10.14mm
Depth
3mm
Dimensions
7.54 x 10.14 x 3mm
Maximum Operating Temperature
+150°C
Housing Material
Glass Fibre Reinforced PET
Contact Material
Beryllium Copper
Minimum Operating Temperature
-65°C
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
23.205 OMR
0.357 OMR Each (In a Tube of 65) (ex VAT)
24.365 OMR
0.375 OMR Each (In a Tube of 65) (inc. VAT)
65
23.205 OMR
0.357 OMR Each (In a Tube of 65) (ex VAT)
24.365 OMR
0.375 OMR Each (In a Tube of 65) (inc. VAT)
65
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Tube |
---|---|---|
65 - 1560 | 0.357 OMR | 23.205 OMR |
1625 - 4810 | 0.320 OMR | 20.816 OMR |
4875 - 12935 | 0.284 OMR | 18.428 OMR |
13000 - 25935 | 0.252 OMR | 16.380 OMR |
26000+ | 0.236 OMR | 15.356 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
6
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
7.54mm
Width
10.14mm
Depth
3mm
Dimensions
7.54 x 10.14 x 3mm
Maximum Operating Temperature
+150°C
Housing Material
Glass Fibre Reinforced PET
Contact Material
Beryllium Copper
Minimum Operating Temperature
-65°C
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).