Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
10.14mm
Dimensions
35.48 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
16.863 OMR
1.204 OMR Each (In a Tube of 14) (ex VAT)
17.706 OMR
1.264 OMR Each (In a Tube of 14) (inc. VAT)
14
16.863 OMR
1.204 OMR Each (In a Tube of 14) (ex VAT)
17.706 OMR
1.264 OMR Each (In a Tube of 14) (inc. VAT)
14
Stock information temporarily unavailable.
Please check again later.
Quantity | Unit price | Per Tube |
---|---|---|
14 - 336 | 1.204 OMR | 16.863 OMR |
350 - 1036 | 1.089 OMR | 15.246 OMR |
1050 - 2786 | 0.968 OMR | 13.552 OMR |
2800 - 5586 | 0.852 OMR | 11.935 OMR |
5600+ | 0.803 OMR | 11.242 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
10.14mm
Dimensions
35.48 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).