Fischer Elektronik Heatsink, Universal Square Alu, 15.7K/W, 35 x 35 x 10mm, Adhesive Foil, Conductive Foil
Technical Document
Specifications
Brand
Fischer ElektronikFor Use With
Universal Square Alu
Length
35mm
Width
35mm
Height
10mm
Dimensions
35 x 35 x 10mm
Thermal Resistance
15.7K/W
Mounting
Adhesive Foil, Conductive Foil
Colour
Black
Package Type
BGA
Material
Aluminium
Country of Origin
Germany
Product details
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
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1.716 OMR
1.716 OMR Each (ex VAT)
1.802 OMR
1.802 OMR Each (inc. VAT)
1
1.716 OMR
1.716 OMR Each (ex VAT)
1.802 OMR
1.802 OMR Each (inc. VAT)
1
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| Quantity | Unit price |
|---|---|
| 1 - 9 | 1.716 OMR |
| 10 - 24 | 1.617 OMR |
| 25 - 49 | 1.573 OMR |
| 50 - 99 | 1.540 OMR |
| 100+ | 1.436 OMR |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Brand
Fischer ElektronikFor Use With
Universal Square Alu
Length
35mm
Width
35mm
Height
10mm
Dimensions
35 x 35 x 10mm
Thermal Resistance
15.7K/W
Mounting
Adhesive Foil, Conductive Foil
Colour
Black
Package Type
BGA
Material
Aluminium
Country of Origin
Germany
Product details
Fischer Elektronik ICK BGA Series Heatsink
ICK BGA series of heatsinks have been designed for use within IC processor heat dissipation. The series can be mounted via thermal adhesive orconductive foil (not included).
Features and Benefits
Black anodised surface.
Heatsink dimensions match respective BGA-type.
Can be affixed directly on to the BGA component with thermal adhesive or conductive foil (not included).
BGA Heatsinks
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products