Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
10V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Maximum Operating Temperature
+105°C
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
10 μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
1.760 OMR
0.176 OMR Each (In a Pack of 10) (ex VAT)
1.848 OMR
0.185 OMR Each (In a Pack of 10) (inc. VAT)
10
1.760 OMR
0.176 OMR Each (In a Pack of 10) (ex VAT)
1.848 OMR
0.185 OMR Each (In a Pack of 10) (inc. VAT)
10
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Please check again later.
Quantity | Unit price | Per Pack |
---|---|---|
10 - 90 | 0.176 OMR | 1.760 OMR |
100 - 240 | 0.132 OMR | 1.320 OMR |
250 - 490 | 0.126 OMR | 1.265 OMR |
500 - 990 | 0.121 OMR | 1.210 OMR |
1000+ | 0.116 OMR | 1.155 OMR |
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
10µF
Voltage
10V dc
Dielectric Material Family
Tantalum
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Maximum Operating Temperature
+105°C
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
10 μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets