Technical Document
Specifications
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
44 Pin Female PLCC
End 2
44 Pin Male DIP
End 1 Number of Contacts
44
End 2 Number of Contacts
44
End 1 Type
PLCC
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Country of Origin
United Kingdom
Product details
PLCC to DIP Sockets
Adaptics of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
14.773 OMR
14.773 OMR Each (ex VAT)
15.512 OMR
15.512 OMR Each (inc. VAT)
1
14.773 OMR
14.773 OMR Each (ex VAT)
15.512 OMR
15.512 OMR Each (inc. VAT)
1
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price |
---|---|
1 - 24 | 14.773 OMR |
25 - 74 | 13.299 OMR |
75 - 199 | 11.820 OMR |
200 - 399 | 10.346 OMR |
400+ | 9.713 OMR |
Technical Document
Specifications
Brand
WinslowPitch
1.27 mm, 2.54 mm
End 1
44 Pin Female PLCC
End 2
44 Pin Male DIP
End 1 Number of Contacts
44
End 2 Number of Contacts
44
End 1 Type
PLCC
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Country of Origin
United Kingdom
Product details
PLCC to DIP Sockets
Adaptics of the same specification as the dual in line package to PLCC versions, which enable PLCCs to be converted to Dual in line package format of 0.1in. pitch and 0.6in. row spacing. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.