Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.
54.230 OMR
10.846 OMR Each (In a Pack of 5) (ex VAT)
56.942 OMR
11.388 OMR Each (In a Pack of 5) (inc. VAT)
5
54.230 OMR
10.846 OMR Each (In a Pack of 5) (ex VAT)
56.942 OMR
11.388 OMR Each (In a Pack of 5) (inc. VAT)
5
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Pack |
---|---|---|
5 - 120 | 10.846 OMR | 54.230 OMR |
125 - 370 | 9.757 OMR | 48.785 OMR |
375 - 995 | 8.674 OMR | 43.368 OMR |
1000 - 1995 | 7.590 OMR | 37.950 OMR |
2000+ | 7.100 OMR | 35.502 OMR |
Technical Document
Specifications
Brand
WinslowPitch
0.65 mm, 2.54 mm
End 1
SSOP 28
End 2
DIP 28
End 1 Number of Contacts
28
End 2 Number of Contacts
28
End 1 Type
SSOP
End 2 Type
DIP
End 1 Gender
Female
End 2 Gender
Male
Mounting Type
Through Hole
Body Orientation
Straight
Contact Material
Brass
Contact Plating
Tin over Nickel
Housing Material
FR4
Country of Origin
United Kingdom
Product details
SOP/SSOP/TSOP/TSSOP/MSOP/QSOP to DIP Adaptors
'Adaptics' converting various Small Outline packages (SOP/SSOP/TSOP/TSSOP/MSOP/QSOP) to dual in line package (DIP) format.
IC Sockets-Package Adaptics DIP
A range of Adaptics which allow the conversion between one package style to another. Development costs may be reduced by avoiding the need to redesign boards for alternative packages.