Technical Document
Specifications
Brand
WinslowNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
50.72mm
Width
3.5mm
Depth
17.66mm
Dimensions
50.72 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
16.995 OMR
1.700 OMR Each (In a Tube of 10) (ex VAT)
17.845 OMR
1.785 OMR Each (In a Tube of 10) (inc. VAT)
10
16.995 OMR
1.700 OMR Each (In a Tube of 10) (ex VAT)
17.845 OMR
1.785 OMR Each (In a Tube of 10) (inc. VAT)
10
Stock information temporarily unavailable.
Please check again later.
Quantity | Unit price | Per Tube |
---|---|---|
10 - 240 | 1.700 OMR | 16.995 OMR |
250 - 740 | 1.529 OMR | 15.290 OMR |
750 - 1990 | 1.358 OMR | 13.585 OMR |
2000 - 3990 | 1.210 OMR | 12.100 OMR |
4000+ | 1.144 OMR | 11.440 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
50.72mm
Width
3.5mm
Depth
17.66mm
Dimensions
50.72 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).