Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
3.218 OMR
3.218 OMR Each (ex VAT)
3.379 OMR
3.379 OMR Each (inc. VAT)
1
3.218 OMR
3.218 OMR Each (ex VAT)
3.379 OMR
3.379 OMR Each (inc. VAT)
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
Quantity | Unit price |
---|---|
1 - 9 | 3.218 OMR |
10 - 19 | 3.091 OMR |
20 - 49 | 2.998 OMR |
50+ | 2.783 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips