Technical Document
Specifications
Brand
KYOCERA AVXCapacitance
100nF
Voltage
1kV dc
Package/Case
1825 (4564M)
Mounting Type
Surface Mount
Dimensions
4.6 x 6.3 x 3.4mm
Length
4.6mm
Depth
6.3mm
Height
3.4mm
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
AVX High Voltage 1825 MLCC series
AVX 1825 Series high-voltage ceramic multilayer capacitors are compact in size and offer high value and low leakage, low ESR at high frequencies. These capacitors are suited to applications such as snubbers in high frequency convertors resonators in SMPS, and high voltage coupling/dc blocking. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak
temperature reached by the ceramic bodies through the soldering process.
1825 Range
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Please check again later.
0.780 OMR
Each (In a Bag of 5) (ex VAT)
0.819 OMR
Each (In a Bag of 5) (inc VAT)
5
0.780 OMR
Each (In a Bag of 5) (ex VAT)
0.819 OMR
Each (In a Bag of 5) (inc VAT)
5
Buy in bulk
quantity | Unit price | Per Bag |
---|---|---|
5 - 45 | 0.780 OMR | 3.900 OMR |
50 - 95 | 0.760 OMR | 3.800 OMR |
100+ | 0.735 OMR | 3.675 OMR |
Technical Document
Specifications
Brand
KYOCERA AVXCapacitance
100nF
Voltage
1kV dc
Package/Case
1825 (4564M)
Mounting Type
Surface Mount
Dimensions
4.6 x 6.3 x 3.4mm
Length
4.6mm
Depth
6.3mm
Height
3.4mm
Maximum Operating Temperature
+125°C
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Product details
AVX High Voltage 1825 MLCC series
AVX 1825 Series high-voltage ceramic multilayer capacitors are compact in size and offer high value and low leakage, low ESR at high frequencies. These capacitors are suited to applications such as snubbers in high frequency convertors resonators in SMPS, and high voltage coupling/dc blocking. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak
temperature reached by the ceramic bodies through the soldering process.