Technical Document
Specifications
Brand
WinslowNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
50.72mm
Width
3.5mm
Depth
17.66mm
Dimensions
50.72 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
16.500 OMR
1.650 OMR Each (In a Tube of 10) (ex VAT)
17.325 OMR
1.732 OMR Each (In a Tube of 10) (inc. VAT)
10
16.500 OMR
1.650 OMR Each (In a Tube of 10) (ex VAT)
17.325 OMR
1.732 OMR Each (In a Tube of 10) (inc. VAT)
10
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Tube |
---|---|---|
10 - 240 | 1.650 OMR | 16.500 OMR |
250 - 740 | 1.485 OMR | 14.850 OMR |
750 - 1990 | 1.320 OMR | 13.200 OMR |
2000 - 3990 | 1.172 OMR | 11.715 OMR |
4000+ | 1.111 OMR | 11.110 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
40
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
50.72mm
Width
3.5mm
Depth
17.66mm
Dimensions
50.72 x 3.5 x 17.66mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).