Technical Document
Specifications
Brand
AAVID THERMALLOYFor Use With
Universal Round Alu
Height
9.14mm
Dimensions
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diameter
28.58mm
Colour
Black
Package Type
BGA
Product details
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
Primarily designed for 68-pin devices
Suitable for high-power LEDs
BGA Heatsinks
Stock information temporarily unavailable.
Please check again later.
4.575 OMR
Each (ex VAT)
4.804 OMR
Each (inc. VAT)
1
4.575 OMR
Each (ex VAT)
4.804 OMR
Each (inc. VAT)
1
Technical Document
Specifications
Brand
AAVID THERMALLOYFor Use With
Universal Round Alu
Height
9.14mm
Dimensions
28.58 (Dia.) x 9.14mm
Thermal Resistance
23.4°C/W
Diameter
28.58mm
Colour
Black
Package Type
BGA
Product details
BGA Heatsink, Radial Fin
Bond-on heatsinks for leadless chip carriers and flat-packs.
Primarily designed for 68-pin devices
Suitable for high-power LEDs