Heatsink, Universal Square Alu, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil

RS Stock No.: 104-036Brand: AAVID THERMALLOYManufacturers Part No.: 306216
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Technical Document

Specifications

Brand

AAVID THERMALLOY

For Use With

Universal Square Alu

Length

23mm

Width

23mm

Height

18mm

Dimensions

23 x 23 x 18mm

Thermal Resistance

23.4K/W

Mounting

Adhesive Foil

Colour

Black

Material

Aluminium

Package Type

BGA

Product details

BGA Heatsink, Tape mounting

A range of BGA heatsinks with thermally conductive adhesive tape mounting.

Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation

BGA Heatsinks

Stock information temporarily unavailable.

Please check again later.

Stock information temporarily unavailable.

0.865 OMR

Each (ex VAT)

0.908 OMR

Each (inc VAT)

Heatsink, Universal Square Alu, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil

1

Available in multiples of 1
10.865 OMR
21.730 OMR
32.595 OMR
43.460 OMR
54.325 OMR
65.190 OMR
76.055 OMR
86.920 OMR
97.785 OMR
108.100 OMR
118.910 OMR
129.720 OMR
1310.530 OMR
1411.340 OMR
1512.150 OMR

0.865 OMR

Each (ex VAT)

0.908 OMR

Each (inc VAT)

Heatsink, Universal Square Alu, 23.4K/W, 23 x 23 x 18mm, Adhesive Foil
Stock information temporarily unavailable.

1

Available in multiples of 1
10.865 OMR
21.730 OMR
32.595 OMR
43.460 OMR
54.325 OMR
65.190 OMR
76.055 OMR
86.920 OMR
97.785 OMR
108.100 OMR
118.910 OMR
129.720 OMR
1310.530 OMR
1411.340 OMR
1512.150 OMR

Buy in bulk

quantityUnit price
1 - 90.865 OMR
10 - 240.810 OMR
25 - 490.795 OMR
50 - 990.780 OMR
100+0.750 OMR

Technical Document

Specifications

Brand

AAVID THERMALLOY

For Use With

Universal Square Alu

Length

23mm

Width

23mm

Height

18mm

Dimensions

23 x 23 x 18mm

Thermal Resistance

23.4K/W

Mounting

Adhesive Foil

Colour

Black

Material

Aluminium

Package Type

BGA

Product details

BGA Heatsink, Tape mounting

A range of BGA heatsinks with thermally conductive adhesive tape mounting.

Tape mounting saves board space by eliminating mounting holes
Convenient peel and stick assembly is quick and clean
Pin Fin array allows omni-directional airflow to maximize heat dissipation

BGA Heatsinks