Heatsink, 20.3°C/W, 11 x 22 x 24mm, PCB Through Hole

RS Stock No.: 712-4285Brand: AAVID THERMALLOYManufacturers Part No.: PF758G
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Technical Document

Specifications

Brand

AAVID THERMALLOY

Length

11mm

Width

22mm

Height

24mm

Dimensions

11 x 22 x 24mm

Thermal Resistance

20.3°C/W

Mounting

PCB Through Hole

Package Type

TO-220

Product details

TO220 Slip-on 20.3°C/W with Tabs

Slip-on heatsink is tin plated and has integrated tabs for soldering to the PC board
Locating features provide simple device alignment and spring action holds the device for good thermal contact

Stock information temporarily unavailable.

Please check again later.

Stock information temporarily unavailable.

0.940 OMR

Each (In a Pack of 5) (ex VAT)

0.987 OMR

Each (In a Pack of 5) (inc VAT)

Heatsink, 20.3°C/W, 11 x 22 x 24mm, PCB Through Hole

5

Available in multiples of 5
54.700 OMR
109.400 OMR
1514.100 OMR
2018.800 OMR
2523.500 OMR
3028.200 OMR
3532.900 OMR
4037.600 OMR
4542.300 OMR
5044.000 OMR
5548.400 OMR
6052.800 OMR
6557.200 OMR
7061.600 OMR
7566.000 OMR

0.940 OMR

Each (In a Pack of 5) (ex VAT)

0.987 OMR

Each (In a Pack of 5) (inc VAT)

Heatsink, 20.3°C/W, 11 x 22 x 24mm, PCB Through Hole
Stock information temporarily unavailable.

5

Available in multiples of 5
54.700 OMR
109.400 OMR
1514.100 OMR
2018.800 OMR
2523.500 OMR
3028.200 OMR
3532.900 OMR
4037.600 OMR
4542.300 OMR
5044.000 OMR
5548.400 OMR
6052.800 OMR
6557.200 OMR
7061.600 OMR
7566.000 OMR

Buy in bulk

quantityUnit pricePer Pack
5 - 450.940 OMR4.700 OMR
50 - 1200.880 OMR4.400 OMR
125 - 2450.850 OMR4.250 OMR
250 - 4950.835 OMR4.175 OMR
500+0.785 OMR3.925 OMR

Technical Document

Specifications

Brand

AAVID THERMALLOY

Length

11mm

Width

22mm

Height

24mm

Dimensions

11 x 22 x 24mm

Thermal Resistance

20.3°C/W

Mounting

PCB Through Hole

Package Type

TO-220

Product details

TO220 Slip-on 20.3°C/W with Tabs

Slip-on heatsink is tin plated and has integrated tabs for soldering to the PC board
Locating features provide simple device alignment and spring action holds the device for good thermal contact