Alpha Lead Free Solder Paste, 500g Tub
Technical Document
Specifications
Product details
OM-350(low Silver) Lead Free Solder Paste
Lead free, no-clean solder paste suitable for fine feature screen printing and reflow using the most demanding soak reflow profiles in air or nitrogen atmospheres. The outstanding reflow process window delivers good soldering on all popular lead free surface finishes. Compliance with Bellcore & JIS reliability testing as well as IPC Class III voiding classifications ensures maximum long-term product reliability.
Contains Alpha SACX® alloy (99% Tin, 0.3% Silver, 0.7% Copper)
Suitable for Pin- in-Paste (Intrusive Reflow)
Wide lead free reflow profile window
Excellent solder joint and flux residue cosmetics
Stable paste viscosity ensuring repeatable printing
High tack and SIR, halide free material
Compatible with SM-110 Stencil Wipes
Standards
ROL0 Designation to ANSI/J-STD-004
Solder Paste - Lead Free
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P.O.A.
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P.O.A.
1
Technical Document
Specifications
Product details
OM-350(low Silver) Lead Free Solder Paste
Lead free, no-clean solder paste suitable for fine feature screen printing and reflow using the most demanding soak reflow profiles in air or nitrogen atmospheres. The outstanding reflow process window delivers good soldering on all popular lead free surface finishes. Compliance with Bellcore & JIS reliability testing as well as IPC Class III voiding classifications ensures maximum long-term product reliability.
Contains Alpha SACX® alloy (99% Tin, 0.3% Silver, 0.7% Copper)
Suitable for Pin- in-Paste (Intrusive Reflow)
Wide lead free reflow profile window
Excellent solder joint and flux residue cosmetics
Stable paste viscosity ensuring repeatable printing
High tack and SIR, halide free material
Compatible with SM-110 Stencil Wipes
Standards
ROL0 Designation to ANSI/J-STD-004
Solder Paste - Lead Free