Bergquist Self-Adhesive Thermal Interface Sheet, 0.08in Thick, 2W/m·K, Gap Pad 2200SF, 100 x 100mm
Technical Document
Specifications
Brand
BergquistDimensions
100 x 100mm
Thickness
0.08in
Length
100mm
Width
100mm
Thermal Conductivity
2W/m·K
Material
Gap Pad 2200SF
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+125°C
Hardness
Shore OO 70
Material Trade Name
Gap Pad 2200SF
Operating Temperature Range
-60 → +125 °C
Country of Origin
United States
Product details
Gap Pad® 2200SF
Gap Pad® 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. Gap Pad® 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework. Typical applications include digital disk drives, proximity near electrical contacts (e.g. DC brush motors, connectors, relays) and fibre optics modules.
Thermal conductivity: 2.0 W/m-K
Silicone-free formulation
Medium compliance with easy handling
Electrically isolating
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25.750 OMR
Each (ex VAT)
27.038 OMR
Each (inc VAT)
1
25.750 OMR
Each (ex VAT)
27.038 OMR
Each (inc VAT)
1
Buy in bulk
| quantity | Unit price |
|---|---|
| 1 - 9 | 25.750 OMR |
| 10 - 24 | 23.560 OMR |
| 25 - 49 | 21.370 OMR |
| 50 - 99 | 19.700 OMR |
| 100+ | 19.335 OMR |
Technical Document
Specifications
Brand
BergquistDimensions
100 x 100mm
Thickness
0.08in
Length
100mm
Width
100mm
Thermal Conductivity
2W/m·K
Material
Gap Pad 2200SF
Self-Adhesive
Yes
Minimum Operating Temperature
-60°C
Maximum Operating Temperature
+125°C
Hardness
Shore OO 70
Material Trade Name
Gap Pad 2200SF
Operating Temperature Range
-60 → +125 °C
Country of Origin
United States
Product details
Gap Pad® 2200SF
Gap Pad® 2200SF is a thermally conductive, electrically isolating, silicone-free polymer specially designed for silicone-sensitive applications. The material is ideal for applications with uneven topologies and high stackup tolerances. Gap Pad® 2200SF is reinforced for easy material handling and added durability during assembly. The material is available with a protective liner on both sides. Gap Pad® 2200SF is supplied with reduced tack on one side allowing for burn-in processes and easy rework. Typical applications include digital disk drives, proximity near electrical contacts (e.g. DC brush motors, connectors, relays) and fibre optics modules.
Thermal conductivity: 2.0 W/m-K
Silicone-free formulation
Medium compliance with easy handling
Electrically isolating