Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

RS Stock No.: 127-041Brand: BergquistManufacturers Part No.: HF225FAC-0.004-AC-1112
brand-logo
View all in Thermal Pads

Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

You may be interested in
Stock information temporarily unavailable.

26.609 OMR

26.609 OMR Each (ex VAT)

27.939 OMR

27.939 OMR Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

1

Available in multiples of 1
126.609 OMR
253.218 OMR
379.827 OMR
4106.436 OMR
5133.045 OMR
6159.654 OMR
7186.263 OMR
8212.872 OMR
9239.481 OMR
10266.090 OMR
11292.699 OMR
12319.308 OMR
13345.917 OMR
14372.526 OMR
15399.135 OMR

26.609 OMR

26.609 OMR Each (ex VAT)

27.939 OMR

27.939 OMR Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Stock information temporarily unavailable.

1

Available in multiples of 1
126.609 OMR
253.218 OMR
379.827 OMR
4106.436 OMR
5133.045 OMR
6159.654 OMR
7186.263 OMR
8212.872 OMR
9239.481 OMR
10266.090 OMR
11292.699 OMR
12319.308 OMR
13345.917 OMR
14372.526 OMR
15399.135 OMR

Stock information temporarily unavailable.

Please check again later.

quantityUnit price
1 - 4926.609 OMR
50 - 9925.674 OMR
100 - 24924.805 OMR
250 - 49924.238 OMR
500+23.826 OMR
You may be interested in

Technical Document

Specifications

Brand

Bergquist

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

You may be interested in