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Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

RS Stock No.: 127-041Brand: BergquistManufacturers Part No.: HF225FAC-0.004-AC-1112
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Technical Document

Specifications

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm

Stock information temporarily unavailable.

26.609 OMR

26.609 OMR Each (ex VAT)

27.939 OMR

27.939 OMR Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in

26.609 OMR

26.609 OMR Each (ex VAT)

27.939 OMR

27.939 OMR Each (inc. VAT)

Bergquist Self-Adhesive Thermal Interface Sheet, 0.102mm Thick, 1W/m·K, Hi-Flow 225F-AC, 11 x 12in
Stock information temporarily unavailable.

Stock information temporarily unavailable.

Please check again later.

quantityUnit price
1 - 4926.609 OMR
50 - 9925.674 OMR
100 - 24924.805 OMR
250 - 49924.238 OMR
500+23.826 OMR

Technical Document

Specifications

Dimensions

11 x 12in

Thickness

0.102mm

Length

11in

Width

12in

Thermal Conductivity

1W/m·K

Material

Hi-Flow 225F-AC

Self-Adhesive

Yes

Maximum Operating Temperature

+120°C

Material Trade Name

Hi-Flow 225F-AC

Operating Temperature Range

Maximum of +120 °C

Country of Origin

United States

Product details

Hi-Flow® 225 FAC

Phase change thermal Interface material with aluminium carrier intended for use between a computer processor and a heat sink.,Adhesive on one side,Requires pressure of assembly to cause flow.,Applications: ,Computer and peripherals,Power conversion,High performance computer processor,Power semiconductors ,Power modules

Thermal impedance : 0.1°C-in²/W (@25psi)
Phase Change Temperature : 55°C
Carrier thickness : 0.038mm