Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
34.903 OMR
34.903 OMR Each (ex VAT)
36.648 OMR
36.648 OMR Each (inc. VAT)
1
34.903 OMR
34.903 OMR Each (ex VAT)
36.648 OMR
36.648 OMR Each (inc. VAT)
1
Stock information temporarily unavailable.
Please check again later.
Quantity | Unit price |
---|---|
1 - 9 | 34.903 OMR |
10 - 19 | 33.506 OMR |
20 - 49 | 32.461 OMR |
50+ | 29.942 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips