Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
36.807 OMR
36.807 OMR Each (ex VAT)
38.647 OMR
38.647 OMR Each (inc. VAT)
1
36.807 OMR
36.807 OMR Each (ex VAT)
38.647 OMR
38.647 OMR Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | 36.807 OMR |
| 10 - 19 | 35.334 OMR |
| 20 - 49 | 34.232 OMR |
| 50+ | 31.784 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
