Chemtronics 3m No Clean Desoldering Braid, Width 1.5mm
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
3.457 OMR
3.457 OMR Each (ex VAT)
3.630 OMR
3.630 OMR Each (inc. VAT)
1
3.457 OMR
3.457 OMR Each (ex VAT)
3.630 OMR
3.630 OMR Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | 3.457 OMR |
| 10 - 19 | 3.318 OMR |
| 20 - 49 | 3.265 OMR |
| 50+ | 3.033 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid