Hazardous Product
Chemtronics 3m No Clean Desoldering Braid, Width 2.8mm
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
Stock information temporarily unavailable.
P.O.A.
Chemtronics 3m No Clean Desoldering Braid, Width 2.8mm
1
P.O.A.
Chemtronics 3m No Clean Desoldering Braid, Width 2.8mm
Stock information temporarily unavailable.
1
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price |
|---|---|
| 1 - 9 | P.O.A. |
| 10 - 19 | P.O.A. |
| 20 - 49 | P.O.A. |
| 50+ | P.O.A. |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips