Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
22.544 OMR
22.544 OMR Each (ex VAT)
23.671 OMR
23.671 OMR Each (inc. VAT)
1
22.544 OMR
22.544 OMR Each (ex VAT)
23.671 OMR
23.671 OMR Each (inc. VAT)
1
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price |
---|---|
1 - 9 | 22.544 OMR |
10 - 19 | 21.646 OMR |
20 - 49 | 21.026 OMR |
50+ | 19.551 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips