Chemtronics 1.5m No Clean Desoldering Braid, Width 2.8mm
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
23.617 OMR
23.617 OMR Each (ex VAT)
24.798 OMR
24.798 OMR Each (inc. VAT)
1
23.617 OMR
23.617 OMR Each (ex VAT)
24.798 OMR
24.798 OMR Each (inc. VAT)
1
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| Quantity | Unit price |
|---|---|
| 1 - 9 | 23.617 OMR |
| 10 - 19 | 22.676 OMR |
| 20 - 49 | 22.028 OMR |
| 50+ | 20.482 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid