Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips
Wick & Braid
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18.090 OMR
18.090 OMR Each (ex VAT)
18.994 OMR
18.994 OMR Each (inc. VAT)
1
18.090 OMR
18.090 OMR Each (ex VAT)
18.994 OMR
18.994 OMR Each (inc. VAT)
1
Buy in bulk
quantity | Unit price |
---|---|
1 - 9 | 18.090 OMR |
10 - 19 | 17.400 OMR |
20 - 49 | 17.125 OMR |
50+ | 15.925 OMR |
Technical Document
Specifications
Product details
Soder-Wick® De-soldering Braid
De-soldering braid packaged in static dissipative bobbins.
Significantly reduces rework/repair time
Minimises the risk of damage to the board
Patented non-corrosive, halide free, organic no-clean flux
BGA desolder braid is designed for removing solder from BGA pads and chips