JST Crimp Extraction Tool, YC Series, Crimp Contact, Extraction Tool Contact

RS Stock No.: 688-0871Brand: JSTManufacturers Part No.: EJ-PHD
brand-logo
View all in Insertion & Extraction Tools

Technical Document

Specifications

Brand

JST

Contact Type

Crimp

Product Type

Crimp Extraction Tool

Sub Type

Extraction Tool

Series

YC

For Use With

SPHD Connectors

Standards/Approvals

No

Product details

PHD Series Tooling

,

688-0871 Extraction tool for PHD Series contacts

2.0mm Wire to Board JST - PHD Series

The PHD Series is a 2.0mm (.079") pitch, crimp style, double-row, Wire-to-Board connector. It is designed to meet the demand for high density and low-profile connection.

Stock information temporarily unavailable.

39.208 OMR

39.208 OMR Each (ex VAT)

41.168 OMR

41.168 OMR Each (inc. VAT)

JST Crimp Extraction Tool, YC Series, Crimp Contact, Extraction Tool Contact

1

Available in multiples of 1
139.208 OMR
278.416 OMR
3117.624 OMR
4156.832 OMR
5190.153 OMR
6228.184 OMR
7266.214 OMR
8304.245 OMR
9342.275 OMR
10380.306 OMR
11418.337 OMR
12456.367 OMR
13494.398 OMR
14532.428 OMR
15570.459 OMR

39.208 OMR

39.208 OMR Each (ex VAT)

41.168 OMR

41.168 OMR Each (inc. VAT)

JST Crimp Extraction Tool, YC Series, Crimp Contact, Extraction Tool Contact

Stock information temporarily unavailable.

1

Available in multiples of 1
139.208 OMR
278.416 OMR
3117.624 OMR
4156.832 OMR
5190.153 OMR
6228.184 OMR
7266.214 OMR
8304.245 OMR
9342.275 OMR
10380.306 OMR
11418.337 OMR
12456.367 OMR
13494.398 OMR
14532.428 OMR
15570.459 OMR

QuantityUnit price
1 - 439.208 OMR
5+38.031 OMR

Technical Document

Specifications

Brand

JST

Contact Type

Crimp

Product Type

Crimp Extraction Tool

Sub Type

Extraction Tool

Series

YC

For Use With

SPHD Connectors

Standards/Approvals

No

Product details

PHD Series Tooling

,

688-0871 Extraction tool for PHD Series contacts

2.0mm Wire to Board JST - PHD Series

The PHD Series is a 2.0mm (.079") pitch, crimp style, double-row, Wire-to-Board connector. It is designed to meet the demand for high density and low-profile connection.