KEMET, 0.25 pF
Technical Document
Specifications
Product details
KEMET C0805 Series
Surface Mount Multilayer Ceramic Chip Capacitors
Ultra-Stable, Low Loss, Class I capacitor series with Tin (Sn) Termination
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
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Stock information temporarily unavailable.
3.887 OMR
0.155 OMR Each (In a Pack of 25) (ex VAT)
4.081 OMR
0.163 OMR Each (In a Pack of 25) (inc. VAT)
Standard
25
3.887 OMR
0.155 OMR Each (In a Pack of 25) (ex VAT)
4.081 OMR
0.163 OMR Each (In a Pack of 25) (inc. VAT)
Stock information temporarily unavailable.
Standard
25
| Quantity | Unit price | Per Pack |
|---|---|---|
| 25 - 100 | 0.155 OMR | 3.887 OMR |
| 125 - 600 | 0.084 OMR | 2.093 OMR |
| 625 - 1225 | 0.060 OMR | 1.495 OMR |
| 1250+ | 0.054 OMR | 1.346 OMR |
Ideate. Create. Collaborate
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- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Product details
KEMET C0805 Series
Surface Mount Multilayer Ceramic Chip Capacitors
Ultra-Stable, Low Loss, Class I capacitor series with Tin (Sn) Termination
0805 Range
Nickel barrier terminations covered with a layer of plated Tin (NiSn). Applications include mobile phones, video and tuner designs, COG/NPO is the most popular formulation of the "temperature compensating", EIA Class I ceramic materials, X7R, X5R formulations are called "temperature stable" ceramics and fall into the EIA Class II materials, Y5V, Z5U formulations are for general purpose use in a limited temperature range, EIA Class II materials; these characteristics are ideal for decoupling applications.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products