Technical Document
Specifications
Brand
KYOCERA AVXCapacitance
100nF
Voltage
600 V dc, 630 V dc
Package/Case
1825 (4564M)
Mounting Type
Surface Mount
Dimensions
4.6 x 6.3 x 3.4mm
Length
4.6mm
Depth
6.3mm
Height
3.4mm
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Maximum Operating Temperature
+125°C
Product details
AVX High Voltage 1825 MLCC series
AVX 1825 Series high-voltage ceramic multilayer capacitors are compact in size and offer high value and low leakage, low ESR at high frequencies. These capacitors are suited to applications such as snubbers in high frequency convertors resonators in SMPS, and high voltage coupling/dc blocking. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak
temperature reached by the ceramic bodies through the soldering process.
1825 Range
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0.695 OMR
Each (In a Bag of 5) (ex VAT)
0.730 OMR
Each (In a Bag of 5) (inc VAT)
5
0.695 OMR
Each (In a Bag of 5) (ex VAT)
0.730 OMR
Each (In a Bag of 5) (inc VAT)
5
Buy in bulk
quantity | Unit price | Per Bag |
---|---|---|
5 - 45 | 0.695 OMR | 3.475 OMR |
50 - 95 | 0.650 OMR | 3.250 OMR |
100 - 245 | 0.605 OMR | 3.025 OMR |
250 - 495 | 0.575 OMR | 2.875 OMR |
500+ | 0.560 OMR | 2.800 OMR |
Technical Document
Specifications
Brand
KYOCERA AVXCapacitance
100nF
Voltage
600 V dc, 630 V dc
Package/Case
1825 (4564M)
Mounting Type
Surface Mount
Dimensions
4.6 x 6.3 x 3.4mm
Length
4.6mm
Depth
6.3mm
Height
3.4mm
Minimum Operating Temperature
-55°C
Terminal Type
Surface Mount
Maximum Operating Temperature
+125°C
Product details
AVX High Voltage 1825 MLCC series
AVX 1825 Series high-voltage ceramic multilayer capacitors are compact in size and offer high value and low leakage, low ESR at high frequencies. These capacitors are suited to applications such as snubbers in high frequency convertors resonators in SMPS, and high voltage coupling/dc blocking. The temperature
gradient during heating or cooling cycles should not exceed 4ºC per
second. The preheat temperature must be within 50ºC of the peak
temperature reached by the ceramic bodies through the soldering process.