Technical Document
Specifications
Brand
Laird TechnologiesDimensions
100 x 100mm
Thickness
5mm
Length
100mm
Width
100mm
Thermal Conductivity
1.2W/m·K
Material
Ceramic Filled Silicone Rubber
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+160°C
Hardness
Shore OO 27
Operating Temperature Range
-40 → +160 °C
Country of Origin
Czech Republic
Product details
T-flex 300 & 3000
T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.
Exceptional compliancy
Square package outline
Thermal conductivity 1.1 W/mK
Breakdown voltage > 10,000 Vac
Operating temperature -40 → 160°C
6.638 OMR
6.638 OMR Each (ex VAT)
6.970 OMR
6.970 OMR Each (inc. VAT)
1
6.638 OMR
6.638 OMR Each (ex VAT)
6.970 OMR
6.970 OMR Each (inc. VAT)
1
Stock information temporarily unavailable.
Please check again later.
Quantity | Unit price |
---|---|
1 - 49 | 6.638 OMR |
50 - 99 | 6.056 OMR |
100 - 249 | 5.450 OMR |
250 - 499 | 5.225 OMR |
500+ | 5.159 OMR |
Technical Document
Specifications
Brand
Laird TechnologiesDimensions
100 x 100mm
Thickness
5mm
Length
100mm
Width
100mm
Thermal Conductivity
1.2W/m·K
Material
Ceramic Filled Silicone Rubber
Self-Adhesive
Yes
Minimum Operating Temperature
-40°C
Maximum Operating Temperature
+160°C
Hardness
Shore OO 27
Operating Temperature Range
-40 → +160 °C
Country of Origin
Czech Republic
Product details
T-flex 300 & 3000
T-flex™ 300 is a silicone gel combined with a ceramic powder to offer a unique combination of compliancy, thermal resistance and price. At pressures of 50 psi, it deflects over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set, enabling the pad to be reused many times. Low thermal resistances can be achieved at low pressures.
Exceptional compliancy
Square package outline
Thermal conductivity 1.1 W/mK
Breakdown voltage > 10,000 Vac
Operating temperature -40 → 160°C