Malico 29mm
Technical Document
Specifications
Product details
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks
Stock information temporarily unavailable.
4.001 OMR
4.001 OMR Each (ex VAT)
4.201 OMR
4.201 OMR Each (inc. VAT)
1
4.001 OMR
4.001 OMR Each (ex VAT)
4.201 OMR
4.201 OMR Each (inc. VAT)
Stock information temporarily unavailable.
1
| Quantity | Unit price |
|---|---|
| 1 - 9 | 4.001 OMR |
| 10 - 24 | 3.684 OMR |
| 25 - 49 | 3.522 OMR |
| 50 - 99 | 3.397 OMR |
| 100+ | 3.122 OMR |
Technical Document
Specifications
Product details
BGA Chipset Heat Sinks
High-performance precision-forged clip-attachment heatsinks for BGA chipsets.
AL6063 grade aluminium at 201 W/m K thermal conductivity
Available in wing-fin and pin-fin types giving high surface area to volume, and excellent thermal performance
Attachment by plastic clip
Excellent performance for both natural convection and low to medium airflow levels with low pressure drop
BGA Heatsinks