Technical Document
Specifications
Brand
MolexSeries
KK 396
Product Type
PCB Header
Pitch
3.96mm
Current
7A
Housing Material
Nylon
Number of Contacts
5
Number of Rows
1
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3.96mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.6mm
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-42-585
Country of Origin
China
Product details
Molex KK 396 3.96 mm PCB Pin Headers - 5273 Series
KK 396 3.96 mm pitch pin headers for use in KK 396 series number 5239 and SPOX 5195 series crimp housings. These PCB pin headers feature a friction locking mechanism for a secure mating connection and are suitable for use in a wide range of applications in the automotive, industrial, consumer, datacommunication and telecommunications industries.
3.96mm Molex KK Range
Stock information temporarily unavailable.
P.O.A.
Each (Supplied in a Bag) (ex VAT)
10
P.O.A.
Each (Supplied in a Bag) (ex VAT)
Stock information temporarily unavailable.
10
Technical Document
Specifications
Brand
MolexSeries
KK 396
Product Type
PCB Header
Pitch
3.96mm
Current
7A
Housing Material
Nylon
Number of Contacts
5
Number of Rows
1
Orientation
Vertical
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Brass
Contact Plating
Tin
Minimum Operating Temperature
-40°C
Row Pitch
3.96mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.6mm
Maximum Operating Temperature
105°C
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-42-585
Country of Origin
China
Product details
Molex KK 396 3.96 mm PCB Pin Headers - 5273 Series
KK 396 3.96 mm pitch pin headers for use in KK 396 series number 5239 and SPOX 5195 series crimp housings. These PCB pin headers feature a friction locking mechanism for a secure mating connection and are suitable for use in a wide range of applications in the automotive, industrial, consumer, datacommunication and telecommunications industries.


