Technical Document
Specifications
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Current Rating
5.0A
Series Number
43650
Voltage Rating
250.0 V
Product details
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Features and Benefits
High current carrying capacity in a small footprint
High temperature housings for IR reflow soldering
Positive latching for secure mating connection
Fully isolated dual beam terminals for reliable electrical performance and contact
Solder tabs for secure connection to PCB
Glow Wire Compliant
Product Application Information
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals
Molex Micro-Fit 3.0 Series
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1.100 OMR
Each (In a Pack of 5) (ex VAT)
1.155 OMR
Each (In a Pack of 5) (inc. VAT)
Standard
5
1.100 OMR
Each (In a Pack of 5) (ex VAT)
1.155 OMR
Each (In a Pack of 5) (inc. VAT)
Standard
5
Buy in bulk
quantity | Unit price | Per Pack |
---|---|---|
5 - 95 | 1.100 OMR | 5.500 OMR |
100 - 370 | 0.925 OMR | 4.625 OMR |
375 - 1495 | 0.895 OMR | 4.475 OMR |
1500 - 2995 | 0.750 OMR | 3.750 OMR |
3000+ | 0.730 OMR | 3.650 OMR |
Technical Document
Specifications
Brand
MolexSeries
MICRO-FIT 3.0
Pitch
3.0mm
Number Of Contacts
2
Number Of Rows
1
Body Orientation
Right Angle
Shrouded/Unshrouded
Shrouded
Connector System
Wire to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Tin
Contact Material
Brass
Current Rating
5.0A
Series Number
43650
Voltage Rating
250.0 V
Product details
Molex Micro-Fit 3.0 3.0mm Single Row SMT Headers with Solder Tab, 43650 Series
Micro-Fit 3.0 3mm pitch wire to board SMT headers which form part of a compact power connector system providing a low to mid-range power distribution solution. With the ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are made of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. To secure these Micro-Fit 3.0 SMT headers to the PCB board, solder tabs are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.
Features and Benefits
High current carrying capacity in a small footprint
High temperature housings for IR reflow soldering
Positive latching for secure mating connection
Fully isolated dual beam terminals for reliable electrical performance and contact
Solder tabs for secure connection to PCB
Glow Wire Compliant
Product Application Information
These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:
Military COTS (Commercial Off The Shelf)
Solar power
Consumer products (dryers, freezers, fridges, washing machines)
Data communications (routers, servers)
Medical
Telecommunications
Gaming terminals