Technical Document
Specifications
Brand
MolexSeries
SLIMSTACK
Pitch
0.5mm
Number Of Contacts
30
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Brass
Series Number
53748
Current Rating
500.0mA
Voltage Rating
50.0 V
Country of Origin
Japan
Product details
SlimStack™ Micro SMT Stacking Connectors
SlimStack™ Plugs and Receptacles available in stacking heights of:
1.5mm SlimStack™ Receptacles Series 54722 and Plugs Series 55560
3.0mm SlimStack™ Receptacles Series 52991 and Plugs Series 53748
4.0mm SlimStack™ Receptacles Series 52991 and Plugs Series 53916
Gold plated contacts for high reliability connectivity
High density capability
Secure retention against shock and vibration
Stock information temporarily unavailable.
3.797 OMR
0.759 OMR Each (In a Pack of 5) (ex VAT)
3.987 OMR
0.797 OMR Each (In a Pack of 5) (inc. VAT)
Standard
5
3.797 OMR
0.759 OMR Each (In a Pack of 5) (ex VAT)
3.987 OMR
0.797 OMR Each (In a Pack of 5) (inc. VAT)
Stock information temporarily unavailable.
Standard
5
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 95 | 0.759 OMR | 3.797 OMR |
| 100 - 370 | 0.670 OMR | 3.349 OMR |
| 375+ | 0.592 OMR | 2.960 OMR |
Technical Document
Specifications
Brand
MolexSeries
SLIMSTACK
Pitch
0.5mm
Number Of Contacts
30
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Brass
Series Number
53748
Current Rating
500.0mA
Voltage Rating
50.0 V
Country of Origin
Japan
Product details
SlimStack™ Micro SMT Stacking Connectors
SlimStack™ Plugs and Receptacles available in stacking heights of:
1.5mm SlimStack™ Receptacles Series 54722 and Plugs Series 55560
3.0mm SlimStack™ Receptacles Series 52991 and Plugs Series 53748
4.0mm SlimStack™ Receptacles Series 52991 and Plugs Series 53916
Gold plated contacts for high reliability connectivity
High density capability
Secure retention against shock and vibration


