Technical Document
Specifications
Brand
MolexSeries
C-Grid
Product Type
PCB Header
Pitch
2.54mm
Current
2.5A
Number of Contacts
14
Housing Material
Polybutylene Terephthalate
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
2.54mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.43mm
Maximum Operating Temperature
120°C
Mating Pin Length
2.54mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-33-584
Product details
Vertical DIL Shrouded Headers, 70246 Series
Mates 70058 Series terminals typical stock number 670-6293
Gold plating depth 0.38 μm unless otherwise stated
2.54mm Molex C-Grid/SL Series
Stock information temporarily unavailable.
5.830 OMR
1.166 OMR Each (In a Pack of 5) (ex VAT)
6.122 OMR
1.224 OMR Each (In a Pack of 5) (inc. VAT)
5
5.830 OMR
1.166 OMR Each (In a Pack of 5) (ex VAT)
6.122 OMR
1.224 OMR Each (In a Pack of 5) (inc. VAT)
Stock information temporarily unavailable.
5
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 20 | 1.166 OMR | 5.830 OMR |
| 25 - 95 | 0.836 OMR | 4.180 OMR |
| 100 - 245 | 0.814 OMR | 4.070 OMR |
| 250 - 495 | 0.798 OMR | 3.988 OMR |
| 500+ | 0.776 OMR | 3.878 OMR |
Technical Document
Specifications
Brand
MolexSeries
C-Grid
Product Type
PCB Header
Pitch
2.54mm
Current
2.5A
Number of Contacts
14
Housing Material
Polybutylene Terephthalate
Number of Rows
2
Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Wire-to-Board
Mount Type
Through Hole
Contact Material
Phosphor Bronze
Contact Plating
Gold
Minimum Operating Temperature
-55°C
Row Pitch
2.54mm
Termination Type
Solder
Contact Gender
Male
Tail Pin Length
3.43mm
Maximum Operating Temperature
120°C
Mating Pin Length
2.54mm
Standards/Approvals
No
Voltage
250 V
Distrelec Product Id
304-33-584
Product details
Vertical DIL Shrouded Headers, 70246 Series
Mates 70058 Series terminals typical stock number 670-6293
Gold plating depth 0.38 μm unless otherwise stated


