Technical Document
Specifications
Brand
MolexSeries
PMC Mezzanine
Pitch
1.0mm
Number Of Contacts
64
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Phosphor Bronze
Series Number
71436
Current Rating
1.0A
Voltage Rating
100.0 V
Product details
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component
4.552 OMR
4.552 OMR Each (ex VAT)
4.780 OMR
4.780 OMR Each (inc. VAT)
Standard
1
4.552 OMR
4.552 OMR Each (ex VAT)
4.780 OMR
4.780 OMR Each (inc. VAT)
Standard
1
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price |
---|---|
1 - 19 | 4.552 OMR |
20 - 74 | 3.990 OMR |
75 - 299 | 3.775 OMR |
300 - 599 | 3.244 OMR |
600+ | 3.087 OMR |
Technical Document
Specifications
Brand
MolexSeries
PMC Mezzanine
Pitch
1.0mm
Number Of Contacts
64
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Phosphor Bronze
Series Number
71436
Current Rating
1.0A
Voltage Rating
100.0 V
Product details
Vertical Stacking SMT Headers & Sockets 64 Way
A range of 1.00mm Pitch Mezzanine IEEE 1386 Receptacles, Surface Mount (SMT) in Dual Row for Vertical Stacking applications.
Allows PCI and S-bus (IEEE 1386) mezzanine cards to connect to VMEbus and Multibus host boards
Suitable for LAN, WAN, telecommunication, PC and workstation applications
Shrouded leaf design (minimises damaging header contacts)
Low insertion force sockets
High-temperature LCP housing for use with reflow solder processes
Antiflux design
Mated heights: 8 → 15mm (see combination guide)
Approvals
UL recognised component