Technical Document
Specifications
Brand
onsemiTransistor Type
NPN
Maximum DC Collector Current
12 A
Maximum Collector Emitter Voltage
400 V
Package Type
TO-220
Mounting Type
Through Hole
Maximum Power Dissipation
100 W
Minimum DC Current Gain
8, 15
Transistor Configuration
Single
Maximum Collector Base Voltage
700 V
Maximum Emitter Base Voltage
9 V
Maximum Operating Frequency
4 MHz
Pin Count
3
Number of Elements per Chip
1
Dimensions
10.67 x 4.83 x 16.51mm
Maximum Operating Temperature
+150 °C
Product details
High Voltage NPN Transistors, Fairchild Semiconductor
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.
5.390 OMR
0.539 OMR Each (In a Pack of 10) (ex VAT)
5.660 OMR
0.566 OMR Each (In a Pack of 10) (inc. VAT)
Standard
10
5.390 OMR
0.539 OMR Each (In a Pack of 10) (ex VAT)
5.660 OMR
0.566 OMR Each (In a Pack of 10) (inc. VAT)
Standard
10
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 90 | 0.539 OMR | 5.390 OMR |
| 100 - 240 | 0.402 OMR | 4.015 OMR |
| 250 - 490 | 0.390 OMR | 3.905 OMR |
| 500 - 990 | 0.346 OMR | 3.465 OMR |
| 1000+ | 0.292 OMR | 2.915 OMR |
Technical Document
Specifications
Brand
onsemiTransistor Type
NPN
Maximum DC Collector Current
12 A
Maximum Collector Emitter Voltage
400 V
Package Type
TO-220
Mounting Type
Through Hole
Maximum Power Dissipation
100 W
Minimum DC Current Gain
8, 15
Transistor Configuration
Single
Maximum Collector Base Voltage
700 V
Maximum Emitter Base Voltage
9 V
Maximum Operating Frequency
4 MHz
Pin Count
3
Number of Elements per Chip
1
Dimensions
10.67 x 4.83 x 16.51mm
Maximum Operating Temperature
+150 °C
Product details
High Voltage NPN Transistors, Fairchild Semiconductor
Bipolar Transistors, Fairchild Semiconductor
Bipolar Junction Transistors (BJT) broad range provides complete solutions for various circuit application needs. Innovative packages are designed for minimal size, highest reliability and maximum thermal performance.


