RS PRO Heatsink, Universal Rectangular Alu, 1.4kΩ/W 35 mm 100 mm 88 mm

RS Stock No.: 234-2542Brand: RS PRO
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Technical Document

Specifications

Brand

RS Pro

Product Type

Heatsink

For Use With

Universal Rectangular Alu

Length

100mm

Width

88 mm

Height

35mm

Fastening

Screw

Thermal Resistance

1.4kΩ/W

Colour

Black

Finish

Black Anodised

Standards/Approvals

RoHS

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Country of Origin

United Kingdom

Product details

Non Standard Extrusion 88mm Wide x 35mm High With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.

View all in Heatsinks

Stock information temporarily unavailable.

9.993 OMR

9.993 OMR Each (ex VAT)

10.493 OMR

10.493 OMR Each (inc. VAT)

RS PRO Heatsink, Universal Rectangular Alu, 1.4kΩ/W 35 mm 100 mm 88 mm

9.993 OMR

9.993 OMR Each (ex VAT)

10.493 OMR

10.493 OMR Each (inc. VAT)

RS PRO Heatsink, Universal Rectangular Alu, 1.4kΩ/W 35 mm 100 mm 88 mm

Stock information temporarily unavailable.

QuantityUnit price
1 - 99.993 OMR
10 - 249.508 OMR
25 - 499.305 OMR
50+9.173 OMR

Technical Document

Specifications

Brand

RS Pro

Product Type

Heatsink

For Use With

Universal Rectangular Alu

Length

100mm

Width

88 mm

Height

35mm

Fastening

Screw

Thermal Resistance

1.4kΩ/W

Colour

Black

Finish

Black Anodised

Standards/Approvals

RoHS

Application

High Power Semiconductor Device, Optoelectronic Device

Material

Aluminium

Country of Origin

United Kingdom

Product details

Non Standard Extrusion 88mm Wide x 35mm High With Channel

ABL design their heat sinks to increase the surface area and therefore dissipate heat over a greater area which leads to quicker cooling of the component. Designed using tempered alloys with greater thermal conductivity to maximise cooling performance. Heat sinks can be used to cool high power semiconductors, optoelectric devices and light emitting diodes.