Technical Document
Specifications
Brand
SamtecSeries
QTE
Pitch
0.8mm
Number Of Contacts
40
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Phosphor Bronze
Current Rating
1.3A
Voltage Rating
225.0 V
Product details
QTE Series High Speed Ground Plane Headers
This range of Board to Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have Alignment Pins. The Contacts and metal ground planes of these Board-to-Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have 0.25 μm Gold plating with the tails being Tin plated.
0.8mm Board to Board - Samtec
P.O.A.
Standard
1
P.O.A.
Standard
1
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Technical Document
Specifications
Brand
SamtecSeries
QTE
Pitch
0.8mm
Number Of Contacts
40
Number Of Rows
2
Body Orientation
Straight
Shrouded/Unshrouded
Shrouded
Connector System
Board to Board
Mounting Type
Surface Mount
Termination Method
Solder
Contact Plating
Gold
Contact Material
Phosphor Bronze
Current Rating
1.3A
Voltage Rating
225.0 V
Product details
QTE Series High Speed Ground Plane Headers
This range of Board to Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have Alignment Pins. The Contacts and metal ground planes of these Board-to-Board QTE Series 0.8 mm pitch High Speed Ground Plane Headers have 0.25 μm Gold plating with the tails being Tin plated.