Technical Document
Specifications
Brand
STMicroelectronicsTransistor Type
PNP
Maximum DC Collector Current
-10 A
Maximum Collector Emitter Voltage
-60 V
Package Type
TO-220
Mounting Type
Through Hole
Maximum Power Dissipation
75 W
Minimum DC Current Gain
20
Transistor Configuration
Single
Maximum Collector Base Voltage
70 V
Maximum Emitter Base Voltage
5 V
Maximum Operating Frequency
2 MHz
Pin Count
3
Number of Elements per Chip
1
Dimensions
9.15 x 10.4 x 4.6mm
Maximum Operating Temperature
+150 °C
Product details
PNP Power Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.
Stock information temporarily unavailable.
3.548 OMR
0.710 OMR Each (In a Pack of 5) (ex VAT)
3.725 OMR
0.745 OMR Each (In a Pack of 5) (inc. VAT)
5
3.548 OMR
0.710 OMR Each (In a Pack of 5) (ex VAT)
3.725 OMR
0.745 OMR Each (In a Pack of 5) (inc. VAT)
Stock information temporarily unavailable.
5
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 5 | 0.710 OMR | 3.548 OMR |
| 10 - 95 | 0.594 OMR | 2.970 OMR |
| 100 - 495 | 0.434 OMR | 2.172 OMR |
| 500 - 995 | 0.385 OMR | 1.925 OMR |
| 1000+ | 0.336 OMR | 1.678 OMR |
Technical Document
Specifications
Brand
STMicroelectronicsTransistor Type
PNP
Maximum DC Collector Current
-10 A
Maximum Collector Emitter Voltage
-60 V
Package Type
TO-220
Mounting Type
Through Hole
Maximum Power Dissipation
75 W
Minimum DC Current Gain
20
Transistor Configuration
Single
Maximum Collector Base Voltage
70 V
Maximum Emitter Base Voltage
5 V
Maximum Operating Frequency
2 MHz
Pin Count
3
Number of Elements per Chip
1
Dimensions
9.15 x 10.4 x 4.6mm
Maximum Operating Temperature
+150 °C
Product details
PNP Power Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.


