Technical Document
Specifications
Brand
STMicroelectronicsTransistor Type
NPN
Maximum DC Collector Current
1 A
Maximum Collector Emitter Voltage
400 V
Package Type
TO-220
Mounting Type
Through Hole
Maximum Power Dissipation
2 W
Minimum DC Current Gain
30
Transistor Configuration
Single
Maximum Collector Base Voltage
500 V
Maximum Emitter Base Voltage
5 V
Maximum Operating Frequency
10 MHz
Pin Count
3
Number of Elements per Chip
1
Dimensions
9.15 x 10.4 x 4.6mm
Maximum Operating Temperature
+150 °C
Product details
High Voltage Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.
Stock information temporarily unavailable.
3.080 OMR
0.616 OMR Each (In a Pack of 5) (ex VAT)
3.234 OMR
0.647 OMR Each (In a Pack of 5) (inc. VAT)
5
3.080 OMR
0.616 OMR Each (In a Pack of 5) (ex VAT)
3.234 OMR
0.647 OMR Each (In a Pack of 5) (inc. VAT)
Stock information temporarily unavailable.
5
| Quantity | Unit price | Per Pack |
|---|---|---|
| 5 - 5 | 0.616 OMR | 3.080 OMR |
| 10 - 95 | 0.512 OMR | 2.558 OMR |
| 100 - 495 | 0.368 OMR | 1.842 OMR |
| 500 - 995 | 0.352 OMR | 1.760 OMR |
| 1000+ | 0.346 OMR | 1.732 OMR |
Technical Document
Specifications
Brand
STMicroelectronicsTransistor Type
NPN
Maximum DC Collector Current
1 A
Maximum Collector Emitter Voltage
400 V
Package Type
TO-220
Mounting Type
Through Hole
Maximum Power Dissipation
2 W
Minimum DC Current Gain
30
Transistor Configuration
Single
Maximum Collector Base Voltage
500 V
Maximum Emitter Base Voltage
5 V
Maximum Operating Frequency
10 MHz
Pin Count
3
Number of Elements per Chip
1
Dimensions
9.15 x 10.4 x 4.6mm
Maximum Operating Temperature
+150 °C
Product details
High Voltage Transistors, STMicroelectronics
Bipolar Transistors, STMicroelectronics
A broad range of NPN and PNP Bipolar Transistors from STMicroelectronics including General Purpose, Darlington, Power and High-Voltage devices in both SMT and Through-hole packages.


