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10, Single-Sided Copper Clad Board FR2 With 35μm Copper Thick, 75 x 100 x 1.6mm

RS Stock No.: 453-8688Brand: SunhayatoManufacturers Part No.: 10
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Technical Document

Specifications

Brand

Sunhayato

Base Material

Synthetic Resin Bonded Paper

Board Type

Plain Copper Board

Number of Sides

1

Dimensions

75 x 100 x 1.6mm

Copper Thickness

35µm

FR Material Grade

FR1

Length

75mm

Thickness

1.6mm

Width

100mm

Country of Origin

Japan

Product details

Copper-Clad Laminated Sheet (cut board)

Paper phenol (FR-1) and glass epoxy (FR-4) provided for general-purpose raw boards

Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies

Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.

Stock information temporarily unavailable.

0.803 OMR

0.803 OMR Each (ex VAT)

0.843 OMR

0.843 OMR Each (inc. VAT)

10, Single-Sided Copper Clad Board FR2 With 35μm Copper Thick, 75 x 100 x 1.6mm

1

Available in multiples of 1
10.803 OMR
21.606 OMR
32.410 OMR
43.213 OMR
54.016 OMR
64.820 OMR
75.623 OMR
86.426 OMR
97.229 OMR
108.032 OMR
118.836 OMR
129.639 OMR
1310.442 OMR
1411.246 OMR
1512.049 OMR

0.803 OMR

0.803 OMR Each (ex VAT)

0.843 OMR

0.843 OMR Each (inc. VAT)

10, Single-Sided Copper Clad Board FR2 With 35μm Copper Thick, 75 x 100 x 1.6mm
Stock information temporarily unavailable.

1

Available in multiples of 1
10.803 OMR
21.606 OMR
32.410 OMR
43.213 OMR
54.016 OMR
64.820 OMR
75.623 OMR
86.426 OMR
97.229 OMR
108.032 OMR
118.836 OMR
129.639 OMR
1310.442 OMR
1411.246 OMR
1512.049 OMR

Stock information temporarily unavailable.

Please check again later.

quantityUnit price
1 - 240.803 OMR
25+0.772 OMR

Technical Document

Specifications

Brand

Sunhayato

Base Material

Synthetic Resin Bonded Paper

Board Type

Plain Copper Board

Number of Sides

1

Dimensions

75 x 100 x 1.6mm

Copper Thickness

35µm

FR Material Grade

FR1

Length

75mm

Thickness

1.6mm

Width

100mm

Country of Origin

Japan

Product details

Copper-Clad Laminated Sheet (cut board)

Paper phenol (FR-1) and glass epoxy (FR-4) provided for general-purpose raw boards

Optocoupler, Intelligent Power Module (IPM) Interface, Avago Technologies

Avago Technologies optocouplers for IPM (Intelligent Power Module) interface exhibit short propagation delay, fast IGBT switching, high common mode transient rejection and wide operating temperature range.
Avago Technologies R2Coupler™ isolation products provide the reinforced insulation and reliability needed for critical automotive and high temperature applications.