TE Connectivity, Z-PACK 2mm Pitch Backplane Connector, Right Angle, 1 Row, 4 Way
Technical Document
Specifications
Brand
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Contact Plating
Gold
Current Rating
16A
Termination Method
Press Fit
Series
Z-PACK
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
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4.120 OMR
4.120 OMR Each (ex VAT)
4.326 OMR
4.326 OMR Each (inc. VAT)
Standard
1
4.120 OMR
4.120 OMR Each (ex VAT)
4.326 OMR
4.326 OMR Each (inc. VAT)
Standard
1
Buy in bulk
| quantity | Unit price |
|---|---|
| 1 - 19 | 4.120 OMR |
| 20 - 74 | 3.915 OMR |
| 75 - 299 | 3.740 OMR |
| 300 - 599 | 3.655 OMR |
| 600+ | 3.610 OMR |
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products
Technical Document
Specifications
Brand
TE ConnectivityNumber Of Contacts
4
Number Of Rows
1
Body Orientation
Right Angle
Pitch
2mm
Contact Material
Copper Alloy
Mounting Type
Through Hole
Contact Plating
Gold
Current Rating
16A
Termination Method
Press Fit
Series
Z-PACK
Country of Origin
United States
Product details
Z-PACK™ HS3 Connectors
The TE Conectivity Z-PACK HS3 board to board backplane connector system has been designed for high speed serial data transfer. The controlled impedance microstrip path incorporated into the design of the Z-PACK HS3 minimises crosstalk and signal degradation. The HS3 is compatible with other Z-PACK family connectors as well as the Universal Power Module (UPM). The HS3 supports data rates of 6.2+ Gbits/s per differential pair.
Ideate. Create. Collaborate
JOIN FOR FREE
No hidden fees!
- Download and use our DesignSpark software for your PCB and 3D Mechanical designs
- View and contribute website content and forums
- Download 3D Models, Schematics and Footprints from more than a million products