Technical Document
Specifications
Brand
TE ConnectivityNumber of Contacts
10
Product Type
PCB Socket
Sub Type
Board-to-Board
Number of Rows
2
Current
12A
Pitch
1.27mm
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
PCB
Orientation
Straight
Connector System
Board-to-Board
Series
AMPMODU System 50
Row Pitch
2.54mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
105°C
Contact Material
Copper
Contact Plating
Gold
Contact Gender
Female
Standards/Approvals
No
Country of Origin
United States
Product details
TE Connectivity 1.27mm x 2.54mm AMPMODU System 50 Board to Board PCB Sockets
AMPMODU System 50 1.27 x 2.54mm board to board PCB socket connectors with a high density design for PCB space saving. The housings of these AMPMODU System 50 1.27 x 2.54mm PCB receptacle connectors are made from high termperature thermoplastic and inorporate PCB hold-dwon posts and stand-offs for drainage.
These AMPMODU System 50 1.27 x 2.54mm board to board PCB receptacle connectors available in a variety of configurations; vertical, right angle, through hole and SMT mount.
TE Connectivity AMPMODU System 50 Interconnection System
AMPMODU System 50 Interconnection System with a compact space saving design and high density 1.27 x 2.54 mm contact spacing for use in high density applications. The AMPMODU System 50 connector system consists of PCB headers, PCB receptacles and wire to board IDC ribbon cable connectors. These connectors are available in various configurations making the AMPMODU System 50 connector system suitable for a wide range of applications. The contacts of the AMPMODU System 50 connectors are made from high conductivity copper alloy with selective gold plating for high electrical performance and reliability.
Stock information temporarily unavailable.
2.870 OMR
1.435 OMR Each (In a Pack of 2) (ex VAT)
3.014 OMR
1.507 OMR Each (In a Pack of 2) (inc. VAT)
2
2.870 OMR
1.435 OMR Each (In a Pack of 2) (ex VAT)
3.014 OMR
1.507 OMR Each (In a Pack of 2) (inc. VAT)
Stock information temporarily unavailable.
2
Technical Document
Specifications
Brand
TE ConnectivityNumber of Contacts
10
Product Type
PCB Socket
Sub Type
Board-to-Board
Number of Rows
2
Current
12A
Pitch
1.27mm
Termination Type
Solder
Housing Material
Liquid Crystal Polymer
Mount Type
PCB
Orientation
Straight
Connector System
Board-to-Board
Series
AMPMODU System 50
Row Pitch
2.54mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
105°C
Contact Material
Copper
Contact Plating
Gold
Contact Gender
Female
Standards/Approvals
No
Country of Origin
United States
Product details
TE Connectivity 1.27mm x 2.54mm AMPMODU System 50 Board to Board PCB Sockets
AMPMODU System 50 1.27 x 2.54mm board to board PCB socket connectors with a high density design for PCB space saving. The housings of these AMPMODU System 50 1.27 x 2.54mm PCB receptacle connectors are made from high termperature thermoplastic and inorporate PCB hold-dwon posts and stand-offs for drainage.
These AMPMODU System 50 1.27 x 2.54mm board to board PCB receptacle connectors available in a variety of configurations; vertical, right angle, through hole and SMT mount.
TE Connectivity AMPMODU System 50 Interconnection System
AMPMODU System 50 Interconnection System with a compact space saving design and high density 1.27 x 2.54 mm contact spacing for use in high density applications. The AMPMODU System 50 connector system consists of PCB headers, PCB receptacles and wire to board IDC ribbon cable connectors. These connectors are available in various configurations making the AMPMODU System 50 connector system suitable for a wide range of applications. The contacts of the AMPMODU System 50 connectors are made from high conductivity copper alloy with selective gold plating for high electrical performance and reliability.


