Vishay 33μF Surface Mount Polymer Capacitor, 10V dc
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
33µF
Dielectric Material Family
Tantalum
Voltage
10V dc
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Maximum Operating Temperature
+105°C
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
33 μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets
Stock information temporarily unavailable.
2.200 OMR
0.220 OMR Each (In a Pack of 10) (ex VAT)
2.310 OMR
0.231 OMR Each (In a Pack of 10) (inc. VAT)
10
2.200 OMR
0.220 OMR Each (In a Pack of 10) (ex VAT)
2.310 OMR
0.231 OMR Each (In a Pack of 10) (inc. VAT)
Stock information temporarily unavailable.
10
| Quantity | Unit price | Per Pack |
|---|---|---|
| 10 - 90 | 0.220 OMR | 2.200 OMR |
| 100 - 240 | 0.182 OMR | 1.815 OMR |
| 250 - 490 | 0.176 OMR | 1.760 OMR |
| 500 - 990 | 0.176 OMR | 1.760 OMR |
| 1000+ | 0.170 OMR | 1.705 OMR |
Technical Document
Specifications
Brand
VishayTechnology
Polymer
Capacitance
33µF
Dielectric Material Family
Tantalum
Voltage
10V dc
Mounting Type
Surface Mount
Package/Case
3216-18
Equivalent Series Resistance
200mΩ
Tolerance
±20%
Length
3.2mm
Depth
1.6mm
Height
1.6mm
Maximum Operating Temperature
+105°C
Dimensions
3.2 x 1.6 x 1.6mm
Series
T55
Electrolyte Type
Solid
Leakage Current
33 μA
Minimum Operating Temperature
-55°C
Product details
T55 Series
T55 Solid Tantalum Surface Mount Chip Capacitors
Moulded Case, High Performance Polymer Type
Ultra-low ESR
Moulded case available in 5 case codes
Terminations: Cases J, P, and A: 100 % tin
Cases B and T: Ni/Pd/Au
Compatible with high volume automatic pick and place equipment
Moisture sensitivity level 3
Applications in Decoupling, smoothing, filtering; Bulk energy storage in wireless cards; Infrastructure equipment; Storage and networking; Computer motherboards; Smartphones and tablets