Technical Document
Specifications
Brand
WinslowNumber Of Contacts
14
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
17.7mm
Width
3.5mm
Depth
10.14mm
Dimensions
17.7 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
18.326 OMR
0.654 OMR Each (In a Tube of 28) (ex VAT)
19.242 OMR
0.687 OMR Each (In a Tube of 28) (inc. VAT)
28
18.326 OMR
0.654 OMR Each (In a Tube of 28) (ex VAT)
19.242 OMR
0.687 OMR Each (In a Tube of 28) (inc. VAT)
28
Stock information temporarily unavailable.
Please check again later.
Quantity | Unit price | Per Tube |
---|---|---|
28 - 672 | 0.654 OMR | 18.326 OMR |
700 - 2072 | 0.588 OMR | 16.478 OMR |
2100 - 5572 | 0.522 OMR | 14.630 OMR |
5600 - 11172 | 0.462 OMR | 12.936 OMR |
11200+ | 0.434 OMR | 12.166 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
14
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
17.7mm
Width
3.5mm
Depth
10.14mm
Dimensions
17.7 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).