Technical Document
Specifications
Brand
WinslowNumber Of Contacts
14
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
17.7mm
Width
3.5mm
Depth
10.14mm
Dimensions
17.7 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
17.864 OMR
0.638 OMR Each (In a Tube of 28) (ex VAT)
18.757 OMR
0.670 OMR Each (In a Tube of 28) (inc. VAT)
28
17.864 OMR
0.638 OMR Each (In a Tube of 28) (ex VAT)
18.757 OMR
0.670 OMR Each (In a Tube of 28) (inc. VAT)
28
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Tube |
---|---|---|
28 - 672 | 0.638 OMR | 17.864 OMR |
700 - 2072 | 0.572 OMR | 16.016 OMR |
2100 - 5572 | 0.506 OMR | 14.168 OMR |
5600 - 11172 | 0.451 OMR | 12.628 OMR |
11200+ | 0.424 OMR | 11.858 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
14
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
17.7mm
Width
3.5mm
Depth
10.14mm
Dimensions
17.7 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).