Technical Document
Specifications
Brand
WinslowNumber Of Contacts
18
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
22.78mm
Width
3.5mm
Depth
10.14mm
Dimensions
22.78 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
18.876 OMR
0.858 OMR Each (In a Tube of 22) (ex VAT)
19.820 OMR
0.901 OMR Each (In a Tube of 22) (inc. VAT)
22
18.876 OMR
0.858 OMR Each (In a Tube of 22) (ex VAT)
19.820 OMR
0.901 OMR Each (In a Tube of 22) (inc. VAT)
22
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Tube |
---|---|---|
22 - 44 | 0.858 OMR | 18.876 OMR |
66 - 88 | 0.836 OMR | 18.392 OMR |
110 - 242 | 0.814 OMR | 17.908 OMR |
264 - 484 | 0.792 OMR | 17.424 OMR |
506+ | 0.786 OMR | 17.303 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
18
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
22.78mm
Width
3.5mm
Depth
10.14mm
Dimensions
22.78 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).