Technical Document
Specifications
Brand
WinslowNumber Of Contacts
20
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
25.32mm
Width
3.5mm
Depth
10.14mm
Dimensions
25.32 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
18.920 OMR
0.946 OMR Each (In a Tube of 20) (ex VAT)
19.866 OMR
0.993 OMR Each (In a Tube of 20) (inc. VAT)
20
18.920 OMR
0.946 OMR Each (In a Tube of 20) (ex VAT)
19.866 OMR
0.993 OMR Each (In a Tube of 20) (inc. VAT)
20
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Tube |
|---|---|---|
| 20 - 480 | 0.946 OMR | 18.920 OMR |
| 500 - 1480 | 0.852 OMR | 17.050 OMR |
| 1500 - 3980 | 0.759 OMR | 15.180 OMR |
| 4000 - 7980 | 0.666 OMR | 13.310 OMR |
| 8000+ | 0.627 OMR | 12.540 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
20
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
25.32mm
Width
3.5mm
Depth
10.14mm
Dimensions
25.32 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).


