Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
10.14mm
Dimensions
35.48 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
15.656 OMR
1.118 OMR Each (In a Tube of 14) (ex VAT)
16.439 OMR
1.174 OMR Each (In a Tube of 14) (inc. VAT)
14
15.656 OMR
1.118 OMR Each (In a Tube of 14) (ex VAT)
16.439 OMR
1.174 OMR Each (In a Tube of 14) (inc. VAT)
14
Stock information temporarily unavailable.
Please check again later.
quantity | Unit price | Per Tube |
---|---|---|
14 - 336 | 1.118 OMR | 15.656 OMR |
350 - 1036 | 1.008 OMR | 14.112 OMR |
1050 - 2786 | 0.898 OMR | 12.568 OMR |
2800 - 5586 | 0.788 OMR | 11.025 OMR |
5600+ | 0.746 OMR | 10.437 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
7.62mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
10.14mm
Dimensions
35.48 x 3.5 x 10.14mm
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Housing Material
PBT
Contact Material
Beryllium Copper
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).