Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
17.66mm
Dimensions
35.48 x 3.5 x 17.66mm
Housing Material
PBT
Contact Material
Beryllium Copper
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).
17.248 OMR
1.232 OMR Each (In a Tube of 14) (ex VAT)
18.110 OMR
1.294 OMR Each (In a Tube of 14) (inc. VAT)
14
17.248 OMR
1.232 OMR Each (In a Tube of 14) (ex VAT)
18.110 OMR
1.294 OMR Each (In a Tube of 14) (inc. VAT)
14
Stock information temporarily unavailable.
Please check again later.
| Quantity | Unit price | Per Tube |
|---|---|---|
| 14 - 336 | 1.232 OMR | 17.248 OMR |
| 350 - 1036 | 1.182 OMR | 16.555 OMR |
| 1050 - 2786 | 1.144 OMR | 16.016 OMR |
| 2800 - 5586 | 1.106 OMR | 15.477 OMR |
| 5600+ | 1.078 OMR | 15.092 OMR |
Technical Document
Specifications
Brand
WinslowNumber Of Contacts
28
Mounting Type
Through Hole
Pin Type
Turned
Pitch
2.54mm
Row Width
15.24mm
Frame Type
Open Frame
Termination Method
Solder
Contact Plating
Gold, Tin
Current Rating
3A
Orientation
Vertical
Length
35.48mm
Width
3.5mm
Depth
17.66mm
Dimensions
35.48 x 3.5 x 17.66mm
Housing Material
PBT
Contact Material
Beryllium Copper
Minimum Operating Temperature
-65°C
Maximum Operating Temperature
+150°C
Country of Origin
United Kingdom
Product details
Ultra Low Profile Gold-Plated Contact DIL Sockets
These sockets have the same specification as the Type 3, low profile versions, but with super flat hollow tail contacts which allow the height of the IC above the PCB to be reduced, as the IC can sit lower in the socket (as shown in the above diagram).


